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[Blog] Laser Assistance and Laser Bonding

Using a laser as a heat source: How does it affect bonding?

In laser bar bonding, achieving a void-free gold-tin eutectic joint is a very simple process. With conventional bonders, both the substrate and the die are heated in some way, allowing for a void-free joint to be realized without damaging the completed assembly. Void-free bonding means that no thermal shock is applied to the substrate or die during the joining process. This blog introduces "laser assist and laser bonding." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

• Company：ファインテック日本
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